Impact of wood densification on the mechanical and thermal properties of graphene/wood flour/epoxy nanocomposites

Summary

No reviewed summary yet. Read the abstract below or open the original publication.

Abstract

Improving the properties of abundant, renewable wood flour offers a promising route to enhance natural filler composites, which are often limited by poor interfacial bonding and structural porosity. This study investigates the synergistic effects of wood densification and graphene nanoplatelets (GNP) on the mechanical, thermal, electrical, and moisture transport properties of wood/graphene/epoxy nanocomposites. White-teak ( Gmelina arborea ) wood was chemically treated, hot pressed, and machined to produce densified wood (DW) flour, which was then incorporated into an epoxy matrix with 0–0.3 wt% GNP. Results suggest that epoxy infiltration into the lumens of densified wood induces interfacial adhesion, while the compact, dense microstructure of densified wood fillers arrests crack propagation. Densification significantly improves filler-matrix bonding and load transfer, resulting in a 15% improvement in tensile strength and a 7% improvement in flexural strength for the densified wood sample (DW) compared to the neat wood (WG) composites for samples without graphene. The incorporation of GNPs further modified composite performance, with the best balance of stiffness, impact resistance, and conductivity observed at 0.2 wt% loading. In this composition, graphene bridging and improved stress transfer increased the tensile modulus by 41%, flexural modulus by 61%, and impact strength by 39% compared with WG0. Thermal analysis revealed a 110°C higher decomposition onset temperature and greater residual mass, confirming improved thermal stability. Although moisture uptake slightly increased, diffusivity decreased due to reduced porosity. Overall, combining densified wood flour with graphene reinforcement yields sustainable composites with enhanced strength and thermal stability, suitable for lightweight structural and insulating applications.

Abstract as supplied by the source. Full text may be restricted by the publisher.